Engineering / Hewlett Packard Enterprise

Hardware Engineering Intern - Summer 2020

In the Summer of 2020, I had the opportunity to work as a Hardware Engineering Intern for Hewlett Packard Enterprise. In this role, I worked with the thermal engineering team in the High Performance Computing (HPC) Group. My project was to design and build a highly versatile liquid cooling test fixture, capable of accommodating a wide variety of thermomechanical hardware testing. I wrote testing procedures for the given tests and created a schematic with instrumentation that would accommodate all the required tests. I then generated two complete bills of materials, one for an analog device with read-out instrumentation and another for a digital device with a data acquisition system. My group decided to pursue the more cost-effective analog device and I shifted my focus to the hardware design and control system.

This liquid cooling test fixture consists of a flexible tubing plumbing circuit, an Arduino control system and interface, and a portable frame for efficient transportation. The plumbing circuit contains a liquid-to-air heat exchanger, pump, reservoir, bypass loop, and instrumentations for pressure, temperature, and flow rate. The control system for this consists of potentiometer inputs and an LCD output display, showing two tachometer feedback signals, three pulse width modulation control signals, and the duty cycle and frequency of these PWM outputs. I designed, programmed, assembled, and trouble-shooted the electro-mechanical control system governing the device’s function. Additionally, I entirely fabricated this test fixture at home in my garage during the final two weeks of my online summer internship.

This position was conducted in an online telecommuting format, providing valuable experience for both technical and interpersonal development. For more information regarding the communication aspects of this internship select the following link to my Communications Portfolio.